Title:  Component Failure Analysis Engineer II

POSITION SUMMARY:

Supports the product level FA and NPI. Perform product level root cause analysis and identify the program is due to component, testing setup, handling, workmanship or design weakness. Provides technical support and verify the board and product level test is properly executed. Performs data monitoring and develops golden sample to ensure the tesing setup is consistent. Analyses the data from production repairman, tackles the weekly top defect that reported by repairman. Supports the RMA root cause analysis.

RESPONSIBILITIES:

1. Plan the analysis step.
   • Based on the background information and application-level analysis result to identify the possible cause of failure, then define the FA plan.
   • Design the deep level FA plan based on the nondestructive or preliminary analysis result.
   • Design component or subassembly level screening and try to reduce risk at product level.
2. Review the CFA report.
   • Verify the conclusion from CFA report that further study any risk or overstress problem at product level.
   • Support the revision of the FA plan and evaluation test content, if not able to find out possible root cause.
   • Participate in the meeting with field application engineer and customer to understand the background of failure and explain the possible cause.
   • Participate in the meeting with supplier to review the root cause analysis and related preventative action.
3. To provide technical support to factorya.    
   • To provide method to verify or analyze the hidden potential quality problem inside product, such as, test coverage of PCBA from subcontractor; thermal stress analysis for the component inside PCBA.
   • Advice the possible solution and detect method on specific process issues or quality improvement to factory.
   • To assist Program/Quality Team in providing feedback to customer on NPI analysis result that come from new process or reliability evaluation.\
4. Strong Electrical/Electronic Engineering foundation.
5. Hands-on experience or strong exposure to electrical failure analysis methodologies.
6. Lead investigations for component electrical abnormalities, shorts, leakage, open circuits, and related defects.
7. Familiar with component level FA tools, such as curve tracer, oscilloscope, Data acquisition system, DC source, AC source, source meter, SEM/EDX, CT X-ray, micro probing, reliability tests (HTOL, Avalanche) and related diagnostic workflows.
8. Ability to analyze component electrical failures, document findings, and support cross functional teams.
9. Adhere to organizational requirements on quality management, health and safety, code of conduct, legal stipulations, environmental, 5S policies and general duty of care.
10. Maintain confidentiality of all information related to the production processes and components, business and other technology including materials.
11. Other duties as assigned.

WORK ENVIRONMENT: 

• Location: Penang Science Park, Simpang Ampat Penang.
• Primarily works in a fast paced manufacturing environment. 
• Rich knowledge of power electronic and RF power amplifier circuit analysis. Well understanding in the circuitry operation. 
• Able to work independently and proactively and could work with product & process functional Failure analysis team to work out root cause analysis and improvement proposal.
• Works under limited supervision.
• Overtime may be necessary in times of increased demand. 
• Travel to international locations may be required.

QUALIFICATIONS:

• Able to explore and evaluate new process technologies.
• With strong communication skills to handle communication with internal and external parties. 
• Organized project planning skills.
• Problem solving.
• Data analysis.
• Knowledge for power semiconductor device, PCB, plastic material properties and passive component. 

EXPERIENCE:

Essential:

• Well understanding of power and RF electronic circuitry operation and related test equipment operation.
• Design and develop the test circuit and fixture for component and related reliability test.
• Good data analysis skills, SPC, PowerBI, test equipment to remove control and programming.
• Experience in electronic circuit analysis, semiconductor and PCBA manufacturing process and FA knowledge.

EDUCATION:

Essential:

• Bachelors Degree in Power/Micro-Electronic Engineering, or equivalent education and/or experience.

OTHERS :

• Applicants must be willing to work in Penang Science Park Simpang Ampat, Penang.
• 1 Full-time position available.

WHY JOIN US!

As part of our total rewards philosophy, we believe in offering and maintaining competitive compensation and benefits programs for our employees to attract and retain a talented, highly engaged workforce. Our compensation programs are focused on equitable, fair pay practices including market-based base pay, an annual pay-for-performance incentive plan.

In addition to our competitive compensation practices, we offer a strong benefits package in each of the countries in which we operate. In Malaysia., we offer a rich benefits package that includes:

• Medical - health care plan, dental, and vision.

• Short and long-term disability and life insurance.

• Executive Employee Health Screening package.

• Generous paid time off starting at 15 days and 19 public holidays.

• 98 days of paid maternity leave for Moms and 7 days of paid paternity leave for Dads.

• AE Child-Of-Employee Scholarship Program.

• Employee Referral Program.

• Career Growth and Learning Opportunity.