Title:  Sr Manager, Process Engineering

POSITION SUMMARY :

Responsible to lead all hybrid power module processes in the power semiconductor manufacturing line. Focus on engineering process, efficiency, yield, and quality improvement activities.

RESPONSIBILITIES :

1. Lead and oversee all hybrid power module processes in the power semiconductor manufacturing line, ensuring best-in-class efficiency, yield, and quality.
2. Possess in-depth knowledge of cleanroom operations and maintain a strict adherence to 10K cleanroom standards.
3. Manage and optimize assembly processes, including:
   • 5mil, 10mil & 15mil Al wedge wire bonding.
   • Solder-paste printing and component placement.  MCM automated component mounting.
   • SST vacuum reflow and other reflow technologies.
   • LID/ Shell attach and potting.
   • Conformal coating.
4. Leverage Lean Six Sigma principles (DMAIC) to identify areas for improvement, implement data-driven solutions, and achieve continuous process optimization.
5. Utilize Statistical Process Control (SPC) tools and analyze Process Capability Index (Cpk) to ensure process stability and product quality.
6. Employ Design of Experiments (DoE) techniques to optimize process parameters and minimize variability.
7. Conduct root cause analysis for semiconductor failures using in-depth knowledge of failure analysis techniques and applications.
8. Develop and implement preventive maintenance strategies under TPM framework to maximize equipment uptime and performance.
9. Conduct process audits, identify areas for improvement, and implement effective solutions.
10. Develop and maintain detailed process documentation, including FMEA, control plan, standard operating procedures (SOPs) and process flowcharts.
11. Train and mentor team members on established processes and procedures.
12. Collaborate with cross-functional teams (engineering, quality control, production) to ensure seamless integration and communication.
13. Manage and troubleshoot process issues and implement corrective and preventive actions.
14. Stay current on industry best practices and new technologies related to power semiconductor manufacturing.
15. Contribute to the development and implementation of new processes and technologies.
16. Ensure activities meet with and integrate with organizational requirements for quality management, health and safety, code of conduct, legal stipulations, environmental, 5S policies, and general duty of care.
17. Other duties as assigned.

WORK ENVIRONMENT :

• Location: Penang Science Park, Simpang Ampat.
• Works in a fast-paced engineering/manufacturing environment and 10K cleanroom operations.
• Also works in a standard office environment and uses general office equipment (telephone, PC, copier, fax machine, etc.).
• Works under minimal supervision.
• Overtime may be necessary in times of increased demand.                 

QUALIFICATIONS :

• Proven track record of successfully optimizing and improving back-end manufacturing processes using Lean Six Sigma and other quality improvement methodologies
• In-depth knowledge and experience with 10K cleanroom operations and protocols.
• Demonstrated expertise in back-end power semiconductor processes, including
  • 5mil, 10mil & 15mil Al wedge wire bonding.
  • Solder-paste printing and component placement.  MCM automated component mounting.
  • SST vacuum reflow and other reflow technologies.
  • LID/ Shell attach and potting.
  • Conformal coating.
• Proficiency in Statistical Process Control (SPC) tools and Process Capability Index (Cpk) analysis.
• Working knowledge of Design of Experiments (DoE) techniques.
• Strong understanding of semiconductor failure analysis techniques and their application.
• Experience in developing and implementing preventive maintenance programs.
• Experience with process mapping and documentation techniques.
• Effective communication skills with the ability to present complex information to stakeholders at various levels.
• Proactive mindset with the ability to identify opportunities for improvement and drive organizational change.
• Strong organizational and project management skills with the ability to handle multiple priorities and meet deadlines.

EXPERIENCE :

Essential:

• Minimum 15 years of experience in a process engineering/ management role within the power semiconductor manufacturing industry.
• Prefer 5+ years of experience in leading/managing people and projects (indirect + direct).

Desirable:

• Black-belt Lean/Six Sigma Certification.

EDUCATION :

Essential :

Bachelor degree in Mechanical Engineering or Material Science or equivalent combination of technical education and experience.

Desirable:

• Master of Science degree preferred.
• Black-belt Lean/Six Sigma Certification.

OTHERS:

Applicants must be willing to work in Penang Science Park, Simpang Ampat.

BENEFITS:

As part of our total rewards philosophy, we believe in offering and maintaining competitive compensation and benefits programs for our employees to attract and retain a talented, highly engaged workforce.

Our compensation programs are focused on equitable, fair pay practices including market-based base pay, an annual pay-for-performance incentive plan, and etc.

In addition to our competitive compensation practices, we offer a strong benefits package in each of the countries in which we operate. In Malaysia., we offer a rich benefits package that includes:

• Medical - health care plan, dental, and vision.
• Short and long-term disability and life insurance.
• Executive Employee Health Screening package.
• Generous paid time off starting at 15 days and 19 public holidays.
• 98 days of paid maternity leave for Moms and 7 consecutive days of paid paternity leave for Dads.
• AE Child-Of-Employee Scholarship Program.
• Employee Referral Program.
• Career Growth and Learning Opportunity.