Title:  Intern - Component Failure Analysis

Job Summary:
We are seeking a motivated and detail-oriented intern to join our Component Failure Analysis team. This internship provides a unique opportunity to gain hands-on experience in material analysis and failure investigation of electronic components, particularly focusing on ceramic substrates. The successful candidate will work closely with cross-functional teams to identify root causes of component failures and contribute to the development of corrective and preventive actions.

Responsibilities:

• Conduct reviews of cracked ceramic substrates and related component characteristics.

• Investigate failures at both hybrid manufacturing and PCBA (Printed Circuit Board Assembly) process levels.

• Perform material-level analysis and in-depth process studies to determine failure mechanisms.

• Utilize Finite Element Analysis (FEA) tools to simulate stress and validate suspected root causes.

• Propose corrective actions based on identified causes and recommend enhancements to material inspection methods.

Requirements:

• Must possess or currently pursuing at least a Bachelor’s Degree in Engineering (Materials, Mechanical, Electrical, or related disciplines).

• No prior working experience required; training and guidance will be provided.

• Willingness to work on-site in Penang Science Park.

• Strong organizational and time management skills.

• Excellent interpersonal and communication abilities.

• Detail-oriented, analytical, and results-driven.