Failure Analysis Engineer 

Position Summary

The Failure Analysis Engineer is responsible for identifying, analyzing, and determining the root causes of failures in electronic components, assemblies, and systems. This role plays a critical part in improving product reliability, supporting manufacturing operations, and driving continuous improvement initiatives across the organization. The ideal candidate has strong analytical skills, hands‑on laboratory experience, and a solid understanding of electronics, materials, and semiconductor technologies.

Key Responsibilities

Failure Analysis & Investigation

• Perform detailed electrical, mechanical, and material-level investigations to determine root causes of component or system failures.
• Use analytical tools such as X‑Ray, SEM/EDS, SAM, Optical Microscopy, FTIR, XRF, TDR, oscilloscopes, and curve tracers.
• Conduct destructive and non-destructive testing of electronic components, PCBs, and assemblies.
• Develop comprehensive FA reports with clear findings, conclusions, and recommendations.

Root Cause & Corrective Action (RCCA)

• Utilize methodologies such as 5 Why, Fishbone, 8D, FMEA to drive structured problem-solving.
• Collaborate with Engineering, Quality, and Manufacturing teams to implement corrective and preventive actions.
• Support product reliability improvement initiatives through trend analysis and risk identification.

Product & Process Support

• Provide FA support for customer returns (RMA), production issues, reliability testing, and new product introduction (NPI).
• Analyze failure trends and communicate findings to cross‑functional teams for continuous improvement.
• Work closely with suppliers to address component‑level defects or process issues.

Documentation & Communication

• Create and maintain detailed documentation of FA procedures, test results, and recommendations.
• Present findings to engineering teams, leadership, and customers as needed.
• Ensure all analyses follow industry standards (IPC, JEDEC, ISO, etc.).

Qualifications

Education

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, or related field.
• Master’s degree preferred (optional).

Experience

• 2+ years of experience in failure analysis, reliability engineering, electronics manufacturing, or semiconductor environment.
• Experience working in a high‑volume electronics or components manufacturing environment preferred.

Technical Skills

• Strong understanding of electronic components (ICs, passives, PCBs, power electronics, sensors).
• Skilled in FA tools: SEM/EDS, X‑Ray, SAM, oscilloscopes, curve tracers, thermal imaging, etc.
• Familiar with reliability testing methods (HALT, HASS, HTOL, burn‑in, thermal cycling).